Enhanced Elevated-Temperature Strength and Creep Resistance of Dispersion-Strengthened Al-Mg-Si-Mn AA6082 Alloys through Modified Processing Route

In the present work, we investigated the possibility of introducing fine and densely distributed alpha-Al(MnFe)Si dispersoids into the microstructure of extruded Al-Mg-Si-Mn AA6082 alloys containing 0.5 and 1 wt % Mn through tailoring the processing route as well as their effects on room- and elevated-temperature strength and creep resistance. The results show that the fine dispersoids formed during low-temperature homogenization experienced less coarsening when subsequently extruded at 350 degrees C than when subjected to a more typical high-temperature extrusion at 500 degrees C. After aging, a significant strengthening effect was produced by beta '' precipitates in all conditions studied. Fine dispersoids offered complimentary strengthening, further enhancing the room-temperature compressive yield strength by up to 72-77 MPa (approximate to 28%) relative to the alloy with coarse dispersoids. During thermal exposure at 300 degrees C for 100 h, beta '' precipitates transformed into undesirable beta-Mg2Si, while thermally stable dispersoids provided the predominant elevated-temperature strengthening effect. Compared to the base case with coarse dispersoids, fine and densely distributed dispersoids with the new processing route more than doubled the yield strength at 300 degrees C. In addition, finer dispersoids obtained by extrusion at 350 degrees C improved the yield strength at 300 degrees C by 17% compared to that at 500 degrees C. The creep resistance at 300 degrees C was greatly improved by an order of magnitude from the coarse dispersoid condition to one containing fine and densely distributed dispersoids, highlighting the high efficacy of the new processing route in enhancing the elevated-temperature properties of extruded Al-Mg-Si-Mn alloys.