Silicon Dielectric Diplexer Module for 600-GHz-B and Frequency-Division Multiplexing Wireless Communication

被引:15
|
作者
Shibata, Norihiko [1 ]
Uemura, Yuta [1 ]
Kawamoto, Yuma [1 ]
Yi, Li [1 ]
Fujita, Masayuki [1 ]
Nagatsuma, Tadao [1 ]
机构
[1] Osaka Univ, Grad Sch Engn Sci, Osaka 5608531, Japan
基金
日本科学技术振兴机构;
关键词
600-GHz band; diplexer; frequency-division multiplexing (FDM); packaging; silicon (Si) dielectric waveguide; terahertz (THz) wireless communication; TERAHERTZ-WAVE; MILLIMETER-WAVE; GUIDE; CODE; TRANSMISSION; FUTURE;
D O I
10.1109/TTHZ.2022.3167946
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We developed a silicon (Si) dielectric diplexer module for 600-GHz-band frequency-division multiplexing wireless communication. This diplexer was developed based on Si dielectric waveguide technology, which provides low-loss transmission characteristics compared with the conventional metallic terahertz-transmission platform, such as metallic hollow waveguides. It includes straight waveguides based on an effective medium composed of Si and air, and a coupler comprising of two adjacent unclad Si waveguides. Furthermore, for the communication system integration, we developed a practical and low-insertion loss module with WR1.5 metallic hollow waveguide input-output interfaces and modularized the diplexer. We performed transmission measurement experiments with the fabricated diplexer module and achieved 3-dB bandwidths of 101 and 37 GHz, and crosstalk of -34 dB at 680 GHz and -41 dB at 618 GHz in the cross and bar directions, respectively. Finally, we performed a two-channel wireless communication experiment using the developed diplexer module in the 600-GHz band. We achieved error-free communication at 10 and 6 Gbit/s on the cross and bar channels, respectively. In addition, we achieved a data rate of up to 12.5 Gbit/s at the forward error correction limits for both channels.
引用
收藏
页码:334 / 344
页数:11
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