Facile Synthesis of Elliptical Cu-Ag Nanoplates for Electrically Conductive Adhesives

被引：0
|
作者：
Zhang, Yu [1 ]
Zhu, Pengli [1 ]
Li, Gang [1 ]
Zhang, Baotan [1 ]
Sun, Rong [1 ]
Wong, Chingping [2 ]
机构：
[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen, Peoples R China
[2] Chinese Univ Hong Kong, Dept Elect Engn, Shatin, Hong Kong, Peoples R China
来源：
2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2015年
关键词：
Cu particles; Elliptical Cu-Ag nanoplates; Electrically Conductive Adhesives; NANOPARTICLES; ELECTRONICS; POLYMER; LEAD;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Elliptical Cu-Ag alloy nanoplates were facile prepared through the in situ substitutional reaction between the as-prepared copper microsized particles and silver ions. The highly purified and uniform Cu-Ag alloy nanoplates, which present a size of 700(star)500(star)70 nm, were used as filler to prepare the conductive adhesive in epoxy resin system. After heat-treatment at 170 degrees C for 60 min, the resistivity of the conductive films is 7.7x10(-4) Omega center dot cm, which is about the same level as commercial conductive adhesives.
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页数：4
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