Overview of Embedded Packaging Technologies

被引：0
|
作者：
Pendse, Raj [1 ]
机构：
[1] STATS ChipPAC, Singapore, Singapore
来源：
2014 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC) | 2014年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：97 / 97
页数：1
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