Cross-Layer Error Resilience for Robust Systems

被引:8
|
作者
Leem, Larkhoon [1 ]
Cho, Hyungmin [1 ]
Lee, Hsiao-Heng [1 ]
Kim, Young Moon [1 ]
Li, Yanjing [1 ]
Mitra, Subhasish [1 ]
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
关键词
CASP; circuit failure prediction; error resilient system architecture; ERSA; LEAP; on-line self-test; diagnostics; reliability; robust system design; soft error; SILICON BUG LOCALIZATION;
D O I
10.1109/ICCAD.2010.5654129
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
A large class of robust electronic systems of the future must be designed to perform correctly despite hardware failures. In contrast, today's mainstream systems typically assume error-free hardware. Classical fault-tolerant computing techniques are too expensive for this purpose. This paper presents an overview of new techniques that can enable a sea change in the design of cost-effective robust systems. These techniques utilize globally-optimized cross-layer approaches, i.e., across device, circuit, architecture, runtime, and application layers, to overcome hardware failures.
引用
收藏
页码:177 / 180
页数:4
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