Improved copper wire bonding with non-contact metrology

被引:0
|
作者
Novak, Matt [1 ]
机构
[1] Bruker Nano Surfaces Div, Tucson, AZ USA
关键词
Copper;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
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页码:23 / 25
页数:3
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