Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys

The mechanical properties of bulk Pb-free solder alloys containing Bi have been characterized in the as-cast and aged conditions. The alloys were the commercially available Sn-3.4Ag-1.0Cu-3.3Bi and Sn-3.4Ag-4.8Bi (wt.%), which had demonstrated good reliability performance in previous circuit board-level testing programs, but have not been considered for high-volume electronic manufacturing. Room- and elevated-temperature tensile testing showed that the addition of Bi greatly reduced the loss in strength due to aging that occurs in the Sn-Ag-Cu ternary alloys. The room-temperature tensile strength of bulk SAC305 was reduced by 37% after aging at 150 degrees C for 336 h, but for SAC-Bi the reduction was not statistically meaningful and in SnAg-Bi the tensile strength increased. These differences are attributed to the presence of Bi and its role in solid solution strengthening and precipitation as a separate phase. The damping capacity of the alloys measured by dynamic mechanical analysis showed similar trends, with tan delta increasing in aged SAC305 but decreasing in SAC-Bi and SnAg-Bi. The reduction in damping seen in SAC-Bi and SnAg-Bi is consistent with Sn and SnPb eutectic solder, indicating that a general microstructural coarsening is responsible. The increase in damping in SAC305 suggests that the transformation of the ternary eutectic by particle coarsening leads to a continuous beta-Sn matrix that contributes to damping. (C) 2011 Elsevier B.V. All rights reserved.