Estimating the (Remaining) lifetime for maintenance and reuse

被引:0
|
作者
Middendorf, A [1 ]
Griese, H [1 ]
Pötter, H [1 ]
Reichl, H [1 ]
Stobbe, I [1 ]
机构
[1] Tech Univ Berlin, Forschungsschwerpunkt Technol Mikroperipher, Abt Nachhaltige Technol, D-13355 Berlin, Germany
关键词
D O I
暂无
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
Electronic products penetrate increasingly today's business and private life. Environmental problems caused by electronics in connection with permanent Growing mass production and this wide spread use has to be solved. Electronics have to bring their contributions to the dematerialization of the economic growth. Beside miniaturization the lengthening of the lifetime is one reasonable way to achieve this goal. The knowledge about a product's remaining lifetime is essential for the concept of condition-oriented maintenance and any reuse opportunity for products and components. For investigation of the remaining life time following information are needed: Knowledge about stress and wear an estimation of a possible damage caused by the reuse/repair process The concept to detect and sample measured quantities will be presented. It is modular and will be created as a Microsystem. The lecture will point out relevant factors for the aging and stressing of electronic products and their measurement. The factors will be rated from technical and economical point of views and results to tailored solutions for different approaches using the modular approach. The reuse of electronic components is generally combined with a resoldering- and soldering process. After resoldering and (a second) soldering different SMD- packages would artificially be aged. Possible damages caused by the resoldering- and soldering process and differences in lifetime will be discussed. A weak point analysis gives first ideas for the reasons.
引用
收藏
页码:467 / 472
页数:6
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