Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword

被引：1
|
作者：
Lucas, JP [1 ]
Chada, S
Kang, SK
Kao, CR
Lin, KL
Ready, J
Yu, J
机构：
[1] Michigan State Univ, E Lansing, MI 48824 USA
[2] Honeywell Elect Mat, Spokane, WA 99216 USA
[3] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
[4] Natl Cent Univ, Dept Chem Engn, Chungli 32054, Taiwan
[5] Natl Cheng Kung Univ, Tainan 70101, Taiwan
[6] MicroCoating Technol, Atlanta, GA 30341 USA
[7] Korea Adv Inst Sci & Technol, Ctr Elect Packaging, Seoul, South Korea
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 12期
关键词：
D O I：
10.1007/s11664-003-0100-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：1359 / 1359
页数：1
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