Modeling Issues and Performance Analysis of High-Speed Interconnects Based on a Bundle of SWCNT

被引:9
|
作者
Giustiniani, Alessandro [1 ]
Tucci, Vincenzo [1 ]
Zamboni, Walter [1 ]
机构
[1] Univ Salerno, DIIIE, I-84084 Fisciano, Italy
关键词
Carbon nanotubes (CNTs); CNT bundles; high frequency; interconnects; nanotechnology; repeaters; single-walled CNT (SWCNT); CARBON-NANOTUBE INTERCONNECTS; LAYERED ELECTRON-GAS; SIGNAL PROPAGATION; SINGLE; CIRCUIT; ELECTRODYNAMICS; TRANSMISSION; TRANSPORT; SYSTEMS; DESIGN;
D O I
10.1109/TED.2010.2050836
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effects of the uncertainties associated with the transverse pattern of carbon nanotubes (CNTs) of the conducting type in a semiglobal interconnect based on a densely packed CNT bundle are investigated. The effectiveness of the insertion of a variable number of repeaters along the interconnect and the influence of the contact resistances between CNTs and external circuitry are also studied. The numerical computations are performed by using a multiconductor transmission line model in which the per-unit length parameters are accurately derived from a macroscopic fluidlike description of the conduction phenomena in CNTs.
引用
收藏
页码:1978 / 1986
页数:9
相关论文
共 50 条
  • [1] Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects
    Zhao, Wensheng
    Yuan, Mengjiao
    Wang, Xiang
    Wang, Dawei
    [J]. CHINESE JOURNAL OF ELECTRONICS, 2023, 32 (06) : 1271 - 1277
  • [2] Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects
    ZHAO Wensheng
    YUAN Mengjiao
    WANG Xiang
    WANG Dawei
    [J]. Chinese Journal of Electronics, 2023, 32 (06) : 1271 - 1277
  • [3] Circuit modeling and performance analysis of SWCNT bundle 3D interconnects
    钱利波
    朱樟明
    丁瑞雪
    杨银堂
    [J]. Journal of Semiconductors, 2013, 34 (09) : 175 - 181
  • [4] Circuit modeling and performance analysis of SWCNT bundle 3D interconnects
    Qian Libo
    Zhu Zhangming
    Ding Ruixue
    Yang Yintang
    [J]. JOURNAL OF SEMICONDUCTORS, 2013, 34 (09)
  • [5] Circuit modeling and performance analysis of SWCNT bundle 3D interconnects
    钱利波
    朱樟明
    丁瑞雪
    杨银堂
    [J]. Journal of Semiconductors, 2013, (09) : 175 - 181
  • [6] ANALYSIS AND MODELING OF INTERCONNECTS FOR HIGH-SPEED DIGITAL APPLICATIONS
    SCHUTTAINE, JE
    [J]. ELECTROMAGNETICS, 1992, 12 (3-4) : 359 - 379
  • [7] Rational ABCD Modeling of high-speed interconnects
    Xu, QW
    Mazumder, P
    [J]. ASP-DAC/VLSI DESIGN 2002: 7TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE AND 15TH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS, 2002, : 147 - 152
  • [8] Temperature-dependent modeling and performance analysis of single-walled carbon nanotube(SWCNT) bundle interconnects
    Lavaniya, Saurabh
    Singh, Satbir
    Rai, Mayank Kumar
    [J]. PROCEEDINGS OF THE 2016 IEEE REGION 10 CONFERENCE (TENCON), 2016, : 2748 - 2752
  • [9] Modeling and analysis of crosstalk between differential lines in high-speed interconnects
    Xiao, F.
    Kami, Y.
    [J]. PIERS 2007 PRAGUE: PROGRESS IN ELECTROMAGNETICS RESEARCH SYMPOSIUM, PROCEEDINGS, 2007, : 488 - +
  • [10] An efficient and novel FDTD method based performance investigation in high-speed current-mode signaling SWCNT bundle interconnect
    Yash Agrawal
    M Girish
    Rajeevan Chandel
    [J]. Sādhanā, 2018, 43