Enabling Low Cost Flexible Smart Packaging System With Internet-of-Things Connectivity via Flexible Hybrid Integration of Silicon RFID Chip and Printed Polymer Sensors

被引：22

作者：

Zhou, Haoyu ^{[1
]}

Li, Siying ^{[1
]}

Chen, Sujie ^{[1
]}

Zhang, Qiuqi ^{[1
]}

Liu, Wenjiang ^{[1
]}

Guo, Xiaojun ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Dept Elect Engn, Shanghai 200240, Peoples R China

来源：

IEEE SENSORS JOURNAL | 2020年 / 20卷 / 09期

基金：

中国国家自然科学基金;

关键词：

Smart packaging; flexible hybrid integration; RFID chip; printed electronics; conductive polymer; gas sensor; anti-open sensor; INTELLIGENT; ARRAY;

D O I：

10.1109/JSEN.2020.2966011

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A flexible hybrid integration strategy combing both advantages of the silicon chip and the printed polymer sensors is demonstrated for low cost smart packaging with internet-of-things connectivity. In the system, the silicon chip, as the general part, performs wireless energy harvesting, sensor signal acquisition, data processing and transmission through mature standard interfaces. The functions, form factor, and substrate of the printed polymer sensors can be customized according to the packaging requirements. To prove the feasibility, a 13.56 MHz radio frequency identification (RFID) chip with multi-sensor interface is designed and taped out. Ammonia and anti-open sensors are fabricated using the same conducting polymer (PEDOT:PSS) through solution printing processes. After characterization of their performance individually, a flexible smart packaging system is implemented with packed pork by integrating the RFID chip and the sensors onto a packaging film. Both the product quality and the integrity of the packaging are able to be conveniently inspected with a smartphone.

引用

页码：5004 / 5011

页数：8