Adhesive Temperature: Effects on Adhesive Properties and Resin-Dentin Bond Strength

Objectives: To evaluate the effect of adhesive temperature on the resin-dentin bond strength (mu TBS), nanoleakage (NL), adhesive layer thickness (AL), and degree of conversion (DC) of ethanol/water- (SB) and acetone-based (PB) etch-and-rinse adhesive systems. Methods: The bottles of the two adhesives were kept at each temperature (5 degrees C, 20 degrees C, 37 degrees C, and 50 degrees C) for 2 hours before application to demineralized dentin surfaces of 40 molars. Specimens were prepared for mu TBS testing. Bonded sticks (0.8 mm(2)) were tested under tension (0.5 mm/min). Three bonded sticks from each tooth were immersed in silver nitrate and analyzed by scanning electron microscopy. The DC of the adhesives was evaluated by Fourier transformed infrared spectroscopy. Results: Lower mu TBS was observed for PB at 50 degrees C. For SB, the mu TBS values were similar for all temperatures. DC was higher at 50 degrees C for PB. Higher NL and thicker AL were observed for both adhesives in the 5 degrees C and 20 degrees C groups compared to the 37 degrees C and 50 degrees C groups. The higher temperatures (37 degrees C or 50 degrees C) reduced the number of pores within the adhesive layer of both adhesive systems. Conclusions: It could be useful to use an ethanol/water-based adhesive at 37 degrees C or 50 degrees C and an acetone-based adhesive at 37 degrees C to improve adhesive performance.