共 50 条
- [1] MATERIALS AND MANUFACTURING CHALLENGES IN HYBRID FLEXIBLE ELECTRONICS [J]. TMS 2010 139TH ANNUAL MEETING & EXHIBITION - SUPPLEMENTAL PROCEEDINGS, VOL 3: GENERAL PAPER SELECTIONS, 2010, : 27 - 40
- [2] A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (11): : 1902 - 1912
- [4] Opportunities and Challenges in Desktop-Inkjet Based Flexible Hybrid Electronics [J]. 2019 IEEE 62ND INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS), 2019, : 746 - 749
- [5] Flexible Electronics - Opportunities and Challenges [J]. 2013 IEEE INTERNATIONAL CONFERENCE OF ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2013,
- [6] Challenges and Opportunities in Flexible Electronics [J]. 2016 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2016,
- [7] Flexible Hybrid Electronics: Manufacturing Flexible Electronics by Printing Technique [J]. Cailiao Daobao/Materials Reports, 2020, 34 (01): : 01009 - 01013
- [8] Advanced flexible electronics: challenges and opportunities [J]. MICRO- AND NANOTECHNOLOGY SENSORS, SYSTEMS, AND APPLICATIONS VI, 2014, 9083
- [9] Flexible Electronics: Status, Challenges and Opportunities [J]. FRONTIERS IN ELECTRONICS, 2020, 1
- [10] Challenges of Printed Electronics on Flexible Substrates [J]. 2012 IEEE 55TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS), 2012, : 582 - 585