Interfacial compositions of solid and liquid in a phase-field model with finite interface thickness for isothermal solidification in binary alloys

被引:186
|
作者
Kim, SG [1 ]
Kim, WT
Suzuki, T
机构
[1] Kunsan Natl Univ, RASOM, Kunsan 573701, South Korea
[2] Kunsan Natl Univ, Dept Mat Sci & Engn, Kunsan 573701, South Korea
[3] Chongju Univ, RASOM, Chonju 360764, South Korea
[4] Chongju Univ, Dept Phys, Chonju 360764, South Korea
[5] Univ Tokyo, Dept Met, Tokyo 113, Japan
来源
PHYSICAL REVIEW E | 1998年 / 58卷 / 03期
关键词
D O I
10.1103/PhysRevE.58.3316
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
We show that a finite interface thickness in an isothermal phase-field model for alloy solidification introduces a chemical potential gradient in the interfacial region and the solute trapping effect, and the relationships between material properties and parameters in the phase-field equation can be determined at a low interface velocity limit condition. Also we show that there are upper bounds on the interface thickness and the interface kinetics coefficient, which vary with thermophysical properties of alloys. The predicted compositions of solid and liquid at the interface with this model are in good agreement with those obtained by numerical simulation of one-dimensional isothermal solidification of an Al-2-mole-%-Si alloy at 870 K.
引用
收藏
页码:3316 / 3323
页数:8
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