The Effects of Postdeposition Annealing on the Crystallization and Electrical Characteristics of HfO2 and ZrO2 Gate Dielectrics

被引:25
|
作者
Jung, Hyung-Suk [1 ,2 ]
Jang, Jae Hyuck [1 ,2 ]
Cho, Deok-Yong [3 ,4 ]
Jeon, Sang-Ho [1 ,2 ]
Kim, Hyo Kyeom [1 ,2 ]
Lee, Sang Young [1 ,2 ]
Hwang, Cheol Seong [1 ,2 ]
机构
[1] Seoul Natl Univ, Dept Mat Sci & Engn, WCU Hybrid Mat Program, Seoul 151744, South Korea
[2] Seoul Natl Univ, Interuniv Semicond Res Ctr, Seoul 151744, South Korea
[3] Seoul Natl Univ, Dept Phys & Astron, CSCMR, Seoul 151744, South Korea
[4] Seoul Natl Univ, Dept Phys & Astron, FPRD, Seoul 151744, South Korea
关键词
ATOMIC LAYER DEPOSITION; THERMAL-STABILITY; THIN-FILMS;
D O I
10.1149/1.3551460
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This study examined the effects of postdeposition annealing (PDA) on the electrical characteristics of atomic layer deposited ZrO2 and HfO2 films using similar precursors and process conditions. After PDA at 600 degrees C, the insulating properties of ZrO2 improved but those of HfO2 deteriorated. The improved insulating properties of ZrO2 were attributed to the negligible increase in the interfacial layer thickness and an amorphous to tetragonal phase transformation. In addition, the degraded insulating properties of HfO2 after PDA at high temperatures were attributed to an abrupt increase in the interfacial layer thickness and the generation of conducting paths through the grain boundaries. (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3551460] All rights reserved.
引用
收藏
页码:G17 / G19
页数:3
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