Low-Cost Flip Chip Consortium

被引:0
|
作者
Nguyen, LT [1 ]
机构
[1] NATL SEMICOND CORP,SANTA CLARA,CA 95052
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:345 / 350
页数:6
相关论文
共 50 条
  • [1] Low-cost flip chip consortium - First year results
    Nguyen, L
    Baker, M
    [J]. 1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 98 - 103
  • [2] Low-cost flip-chip on board
    Philips Cent for Manufacturing, Technology, Eindhoven, Netherlands
    [J]. IEEE Trans Compon Packag Manuf Technol Part B Adv Packag, 4 (736-746):
  • [3] Low-cost flip-chip on board
    Baggerman, AFJ
    Caers, JFJM
    Wondergem, JJ
    Wagemans, AG
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (04): : 736 - 746
  • [4] Assembly equipment for low-cost flip chip technologies
    Kergel, H
    Monno, B
    Schliesser, R
    [J]. 1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 600 - 605
  • [5] Low-cost flip chip technology for organic substrates
    Baba, S
    [J]. FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 1998, 34 (01): : 78 - 86
  • [6] Low-cost flip chip technology for organic substrates
    [J]. Fujitsu Sci Tech J, 1 (78-86):
  • [7] Underfill delamination analysis of flip chip on low-cost board
    Cheng, ZN
    Xu, BL
    Zhang, Q
    Cai, X
    Huang, WD
    Xie, XM
    [J]. ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 280 - 285
  • [8] Low-cost flip-chip alternatives for millimeter wave applications
    Heyen, J
    Schroeder, J
    Jacob, AF
    [J]. 2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 2205 - 2208
  • [9] High performance underfills for low-cost flip-chip applications
    Shi, S
    Jefferson, G
    Wong, CP
    [J]. 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 42 - 45
  • [10] Reliability issues of low-cost overmolded flip-chip packages
    Lin, YM
    Liu, WN
    Guo, WF
    Shi, FG
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (01): : 79 - 88