A 1 &x00D7; 2 Taper Slot Antenna Array With Flip-Chip Interconnect via Glass-IPD Technology for 60 GHz Radar Sensors

被引：10

作者：

Xia, Haiyang ^{[1
,2
]}

Zhang, Tao ^{[2
,3
]}

Li, Lianming ^{[1
,2
]}

Zheng, Fu-Chun ^{[1
,2
]}

机构：

[1] Southeast Univ, Natl Mobile Commun Res Lab, Nanjing 210096, Peoples R China

[2] Purple Mt Labs, Nanjing 211111, Peoples R China

[3] Xidian Univ, Sch Microelect, Xian 710071, Peoples R China

来源：

IEEE ACCESS | 2020年 / 8卷

关键词：

60; GHz; antenna in package (AiP); CPW-slotline transition; flip-chip; glass integrated passive device (Glass-IPD); radar sensors; taper slot antenna (TSA);

D O I：

10.1109/ACCESS.2020.2983485

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

A low cost, broadband and compact antenna in package solution (AiP) is proposed for 60 GHz low-power radar sensor applications. Following a glass integrated passive device (Glass-IPD) manufacturing process, a compact low cost taper slot antenna (TSA) is designed on a substrate with a thickness beyond Yngvesson & x2019;s range. To realize high gain and front-to-back ratio, the antenna is optimized by introducing a truncated ground. A antenna array prototype is realized with a dummy transmission line chip in the dimension of mm(2). Including the flip chip interconnect, the measured results demonstrate a 10 dB impedance bandwidth of GHz. The calculated gain is higher than 6.5 dBi in the end-fire direction over the entire 60 GHz band. Based on a physical RLC equivalent circuit, by co-design of the antenna with solder balls, the flip chip interconnect is compensated with a passive network. For the compensation network, its working bandwidth is from 0.1 to 67 GHz, while its insertion loss at 60 GHz is less than 0.2 dB.

引用

页码：61790 / 61796

页数：7