Crescent Shaped Patterns for Self-alignment of Micro-parts: Part II - Self-alignment Demonstration and Conductivity Evaluation

A "crescent-shaped" binding alignment mark, more applicable to the self-alignment than reported "tear-drop/elliptical hole" pattern, was designed and comparatively studied with other possible alignment marks by introducing the overlap ratio analysis (DTIP 2011). Recently, in order to apply this novel design to micro-parts with positive and negative poles on the binding sites, a modified "crescent-shaped" pattern with an insulated space area, defined as "crescent-shaped/interval" for self-alignment of micro-parts with two poles was further proposed and discussed. In this report however, the self-alignment process has been in-situ observed and studied using a "square" binding alignment pattern with relatively higher energy barrier but four fully aligned orientations at four off-set angles. Sequential images reveal a slow translational motion in the early stage followed by a faster rotational alignment. The conductivity evaluation before and after the self-alignment of micro-parts has been also preliminarily considered.