Study on the structure and adhesion of copper thin films on chemically modified polyimide surfaces

被引:0
|
作者
Lau, LL [1 ]
Xiong, Y [1 ]
Hong, L [1 ]
机构
[1] Natl Univ Singapore, Dept Environm Chem & Engn, Singapore 119260, Singapore
关键词
polyimide; surface modification; wet treatment; adhesion; copper plating;
D O I
暂无
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Upilex-s((R)) [BPDA-PDA, poly(biphenyldianhydride-p-phenylenediamine)] and 6FDA-ODA [4,4'-(hexafluoroisopropylidene)diphthalic anhydride-4.4'-oxydianiline] polyimide sheets were subjected to wet treatment using ethylenediamine (EDA) and hydrazine as the base. The results of wet treatment were evaluated in terms of elemental analysis (N/C atomic ratio) obtained using XPS as well as surface morphologies determined using AFM and SEM. Furthermore, a copper layer was deposited onto the modified surface via electroless plating. The adhesion strength between the copper layer and the modified surfaces was assessed by the tape-peel test. A large adhesion enhancement was achieved when copper was plated onto the modified surfaces of Pl sheets as compared to the untreated samples.
引用
收藏
页码:331 / 343
页数:13
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