On-chip crosstalk evaluation between adjacent interconnections

被引：0

作者：

Servel, G ^{[1
]}

Deschacht, D ^{[1
]}

机构：

[1] UMR CNRS 5506, Lab Informat Robot & Microelect, F-34392 Montpellier 05, France

来源：

ICECS 2000: 7TH IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS & SYSTEMS, VOLS I AND II | 2000年

关键词：

D O I：

暂无

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

With the reduction of distances between wires in deep sub-micron technologies, coupling capacitances are becoming significant. These increasing of capacities cause noises capable of propagating a logical fault. A bad evaluation of the crosstalk could be at the origin of a malfunction of the circuit. In this paper we propose a new closer form expression for the crosstalk between two, three and five lines. Results given by our expression will be compared to simulations with SPICE in technology 0.25 mum.

引用

页码：827 / 830

页数：4

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