Optimization of electrothermal material parameters using inverse modeling

被引：1
|
作者：
Minixhofer, R [1 ]
Holzer, S [1 ]
Heitzinger, C [1 ]
Fellner, J [1 ]
Grasser, T [1 ]
Selberherr, S [1 ]
机构：
[1] Austriamicrosyst AG, A-8141 Unterpremstatten, Austria
来源：
ESSDERC 2003: PROCEEDINGS OF THE 33RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE | 2003年
关键词：
D O I：
10.1109/ESSDERC.2003.1256889
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of Polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of Polysilicon fuses for reliability and speed.
引用
收藏
页码：363 / 366
页数：4
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