Thermal residual stresses in plates and coatings composed of multi-layered and functionally graded materials

被引:99
|
作者
Shaw, LL [1 ]
机构
[1] Univ Connecticut, Dept Met & Mat Engn, Storrs, CT 06269 USA
关键词
thermal residual stresses; multilayers materials; functionally graded materials;
D O I
10.1016/S1359-8368(97)00029-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, thermal residual stresses in multi-layered and compositionally graded plates and coatings were analyzed. Systematic studies on effects of different material combinations, including the compositional gradient, the elastic modulus, the coefficient of thermal expansion, and the number of layers in the case of multi-layered materials on the magnitude and distribution of residual stresses were conducted. Geometry changes of plates and coatings due to these residual stresses were also investigated. It was found that the distribution and magnitude of thermal residual stresses within a plate can be adjusted by controlling the compositional gradient and selecting a proper combination of ceramic and metal constituents. When the compositional gradient of a plate is such that a rapid change in volume fraction and properties occurs near the ceramic face and a gradual change near the metal face, a residual compressive stress is produced on both faces of the plate. However, when the rapid change in volume fraction and properties occurs near the metal face and the gradual change near the ceramic face, a residual tensile stress is generated on both faces of the plate. Minimum residual stresses are obtained when the plate has a Linear compositional gradient. As for compositionally graded coatings, the magnitude of the residual stresses on the surface of the coating cannot be decreased by introducing a compositional gradient. The gradient coating only alters the characteristics of the residual stress distribution. (C) 1998 Elsevier Science Limited. All rights reserved.
引用
收藏
页码:199 / 210
页数:12
相关论文
共 50 条
  • [1] Thermal residual stresses in functionally graded coatings
    Zhang, Xiancheng
    Xu, Binshi
    Wang, Haidou
    Wu, Yixiong
    [J]. Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering, 2006, 42 (01): : 18 - 22
  • [2] Thermal residual stresses in functionally graded and layered 6061 Al/SiC materials
    Ho, S
    Lavernia, EJ
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1996, 27 (10): : 3241 - 3249
  • [3] Residual stresses in functionally graded thermal barrier coatings
    Bhattacharyya, Abir
    Maurice, David
    [J]. MECHANICS OF MATERIALS, 2019, 129 : 50 - 56
  • [4] Residual stresses in functionally graded plates
    Achim Neubrand
    Tai-Joo Chung
    Jürgen Rödel
    Eric D. Steffler
    Theo Fett
    [J]. Journal of Materials Research, 2002, 17 : 2912 - 2920
  • [5] Residual stresses in functionally graded plates
    Neubrand, A
    Chung, TJ
    Rödel, J
    Steffler, ED
    Fett, T
    [J]. JOURNAL OF MATERIALS RESEARCH, 2002, 17 (11) : 2912 - 2920
  • [6] IN-PLANE THERMAL RESIDUAL STRESSES IN FUNCTIONALLY GRADED PLATES
    Apalak, M. Kemal
    Demirbas, M. Didem
    [J]. PROCEEDINGS OF THE ASME 12TH BIENNIAL CONFERENCE ON ENGINEERING SYSTEMS DESIGN AND ANALYSIS - 2014, VOL 1, 2014,
  • [7] Residual thermal stresses in multilayered functionally graded material plates
    Jin, G
    Awaji, H
    [J]. MATERIALS SCIENCE RESEARCH INTERNATIONAL, 2003, 9 (02): : 125 - 130
  • [8] Thermal loading in multi-layered and/or functionally graded materials: Residual stress field, delamination, fatigue and related size effects
    Carpinteri, A
    Pugno, N
    [J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2006, 43 (3-4) : 828 - 841
  • [9] Prediction of Thermal Residual Stresses in Sigmoid Functionally Graded Materials
    Parihar, Rityuj Singh
    Setti, Srinivasu Gangi
    Sahu, Raj Kumar
    [J]. 1ST INTERNATIONAL CONFERENCE ON ADVANCES IN MECHANICAL ENGINEERING AND NANOTECHNOLOGY (ICAMEN 2019), 2019, 2148
  • [10] Thermal stresses in functionally graded materials
    Noda, N
    [J]. JOURNAL OF THERMAL STRESSES, 1999, 22 (4-5) : 477 - 512