Introduction to the Special Issue for the 2017 IEEE International Symposium on EMC plus SIPI

被引：0

作者：

Spadacini, G. ^{[1
]}

Fan, J. ^{[2
]}

机构：

[1] Politecn Milan, I-20133 Milan, MI, Italy

[2] Missouri Univ Sci & Technol, Rolla, MO 65409 USA

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2018年 / 60卷 / 04期

关键词：

D O I：

10.1109/TEMC.2018.2795358

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1036 / 1037

页数：2

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