Advances in low temperature co-fired ceramic (LTCC) for ever increasing microelectronic applications

During the past few years, customers of electronic component manufacturing firms have been continually increasing their demands on electronic systems engineer and manufacturing firms. Some of the key indicators, which continually drive these increasing demands on LTCC (Low Temperature Co-Fired Ceramic), are increased system speeds, constant pressures to reduce overall product/system costs, significant reductions in time-to-market and smaller footprints. These key indicators combined with the need to significantly reduce the costs of Non Recurring Engineering (NRE) have led to significant paradigm shifts in the manufacture of microelectronic packaging. A number of these system enhancements/improvements will be covered in this paper.