A Study of Package Warpage for Package on Package (PoP)

被引：17
|
作者：
Amagai, Masazumi [1 ]
Suzuki, Yutaka [1 ]
机构：
[1] Texas Instruments Inc, TMG Japan, Modeling Grp, Miho 3000496, Japan
来源：
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2010年
关键词：
D O I：
10.1109/ECTC.2010.5490967
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Package warpage is a primary concern in a package-on-package. To enhance the accuracy of modeling prediction, viscoelastic parameters, the change of material properties after injection mold cure (IMC) and post mold cure (PMC) temperature and it's time, and cure shrinkage were studied with a dynamic modulus analysis (DMA) and a thermal mechanical analysis (TMA) for a mold compound. A nano-indentation tool was used to characterize a viscoelasticity of underfill material. Material properties obtained from the TMA, DMA and nano-indentation tools were introduced to finite-element-based models. The validation of models was verified with a shadow moire for package warpage.
引用
收藏
页码：226 / 233
页数：8
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