共 50 条
- [1] DESIGN AND FABRICATION OF WAFER-LEVEL PACKAGED MEMS PIRANI GAUGE WITH SORROUNDED HEAT SINKS [J]. 2017 19TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2017, : 950 - 953
- [2] DIFFERENTIAL MICRO-PIRANI GAUGE FOR MONITORING MEMS WAFER-LEVEL PACKAGE [J]. 2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015), 2015, : 89 - 92
- [3] MEMS Wafer-Level Vacuum Packaging with Transverse Interconnects for CMOS Integration [J]. PROCEEDINGS OF THE IEEE 2008 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2008, : 189 - 192
- [4] Wafer-level vacuum packaging for MEMS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1999, 17 (04): : 2295 - 2299
- [7] Vacuum wafer-level packaging for MEMS applications [J]. MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VIII, 2003, 4979 : 271 - 278
- [8] WAFER-LEVEL VACUUM SEALING AND ENCAPSULATION FOR FABRICATION OF CMOS MEMS THERMOELECTRIC POWER GENERATORS [J]. MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2010, : 1175 - 1178
- [9] Wafer-level vacuum/hermetic packaging technologies for MEMS [J]. RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES IX, 2010, 7592
- [10] A Wafer-LeVel Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding [J]. Tien Tzu Hsueh Pao/Acta Electronica Sinica, 2023, 51 (09): : 2517 - 2525