Research on Dynamic Model of Printed Circuit Board Based on Finite Element Method

被引：6
|
作者：
Wei, Hui [1 ]
Xu, Liangjun [1 ]
机构：
[1] Beijing Univ Posts & Telecommun, Beijing, Peoples R China
来源：
GREEN ENERGY AND SUSTAINABLE DEVELOPMENT I | 2017年 / 1864卷
关键词：
printed circuit board; finite element; modal analysis; vibration; orthogonal anisotropic; boundary conditions; lumped mass; MODAL-ANALYSIS;
D O I：
10.1063/1.4992899
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
The vibration characteristics of printed circuit boards are related to the reliability of electronic components installed on their surface. Finite element software is a powerful tool to analyze the vibration characteristics of printed circuit boards, and the correct establishment of finite element model is very important. In this paper, the dynamic model of anisotropic printed circuit board is established by analyzing the material properties of printed circuit board. The influence of boundary condition and lumped mass on the vibration characteristics of printed circuit board is analyzed. In order to establish a more realistic printed circuit The finite element model of the plate provides the necessary basis..
引用
收藏
页数：7
相关论文
共 50 条
  • [1] Modal Analysis of the Printed Circuit Board Based on Finite Element Method
    Ren Guoquan
    Li Ben
    Li Dongwei
    Jiao Yingqi
    PROCEEDINGS OF THE 2014 INTERNATIONAL CONFERENCE ON COMPUTER SCIENCE AND ELECTRONIC TECHNOLOGY, 2015, 6 : 150 - 154
  • [2] Finite element modeling of printed circuit board for structural analysis
    Lee, M
    PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 42 - 51
  • [3] Accuracy of simplified printed circuit board finite element models
    Amy, Robin Alastair
    Aglietti, Guglielmo S.
    Richardson, Guy
    MICROELECTRONICS RELIABILITY, 2010, 50 (01) : 86 - 97
  • [4] Finite element model verification for packaged printed circuit board by experimental modal analysis
    Lee, Ying-Chih
    Wang, Bor-Tsuen
    Lai, Yi-Shao
    Yeh, Chang-Lin
    Chen, Rong-Sheng
    MICROELECTRONICS RELIABILITY, 2008, 48 (11-12) : 1837 - 1846
  • [5] Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis
    Lee, Ying-Chih
    Wang, Bor-Tsuen
    Lai, Yi-Shao
    Yeh, Chang-Lin
    Chen, Rong-Sheng
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 424 - +
  • [6] Sensitivity analysis of simplified Printed Circuit Board finite element models
    Amy, Robin Alastair
    Aglietti, G. S.
    Richardson, Guy
    MICROELECTRONICS RELIABILITY, 2009, 49 (07) : 791 - 799
  • [7] Printed circuit board model updating based on response surface method
    Xu, Fei
    Li, Chuanri
    Jiang, Tongmin
    Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics, 2015, 41 (03): : 449 - 455
  • [8] Research on the Partial Element Equivalent Circuit of Radio Frequency Coil on the Printed Circuit Board
    Xu X.
    Xu Z.
    Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2022, 37 (17): : 4284 - 4293
  • [9] Printed Circuit Board Vibration Analysis using Simplified Finite Element Models
    Burmitskih, Anton V.
    Lebedev, Aleksandr P.
    Levitskiy, Alexey A.
    Moskovskih, Mikhail S.
    2013 INTERNATIONAL SIBERIAN CONFERENCE ON CONTROL AND COMMUNICATIONS (SIBCON), 2013,
  • [10] Dynamic stiffening of a printed circuit board
    Universidad Nacional del Sur, Bahia Blanca, Argentina
    Acustica, 2 (196-197):
12345