UPDATED DESIGN AND DEVELOPMENT ROUTE FOR CH HCCB IBM AND ITS MOCKUP

被引:0
|
作者
Hu Gang [1 ]
Feng Kaiming [1 ]
Zhao Zhou [1 ]
Zhang Guoshu [1 ]
Wang Qijie [1 ]
Cao Qixiang [1 ]
Chen Yanjing [1 ]
Ye Xingfu [1 ]
Wang Pinghuai [1 ]
Wang Zeming [2 ]
Yu Dehuai [2 ]
Tao Shiquan [2 ]
Wang Shizhong [2 ]
Tao Haiyan [2 ]
机构
[1] Southwestern Inst Phys, Chengdu, Sichuan, Peoples R China
[2] Chinese Nucl Power Inst China, Chengdu, Sichuan, Peoples R China
关键词
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中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Chinese helium-cooled ceramics breeder test blanket module (CH HCCB TBM) is deteimined to be tested in ITER machine to get data for fusion reactor design and development in future. Chinese TBM is designed to occupy half of port C with 484mm in torroidal and 1660mm in poloidal. Radial length is 675mm. TBM is composed of box, 12 submodules and independent backplate. Box formed by first wall, grids and caps have 12 caivities to hold submodules. Box and submodules are supported by backplate by welding. Backplate distribute helium with flow rate 1.36kg/s to cool first wall and then part of it go out of TBM by bypass. The rest 0.77kg/s go on to cool caps and girds first and then cool submodules. Submodules with dimensions 250mm X 202mm X 318mm have independent cooling and purging systems connected to backplate manifold systems. In a submodule, two U-shaped structures hold breeding material Li4SiO4 pebbles. Out of the structure filled beryllium pebbles. Neutronics results show that tritium production is similar to 64mg/FPD. Maximum temperature 538 degrees C of structure material occurs in the front of first wall with surface heat flux 0.5MW/m(2). Maximum total stress at first wall is 471MPa at 394 degrees C; that in submodules is 426MPa at 400 degrees C; that in backplate is 526MPa at 410 degrees C, In order to explore development technologies for the TBM, a mockup with dimensions 484mm (torroidal) X 592mm (poloidal) X 675mm (radial) has been designed. The mockup with similar structure ignores bypass and purge gas systems. In the mockup, there's only one submodule and the other three are replaced by submodule replacements. By discussions and investigations, development route has been decided and the mockup is being fabricated
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页数:5
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