Millimeter-wave three-dimensional masterslice MMICs

被引：0
|
作者：
Nishikawa, K [1 ]
Kamogawa, K [1 ]
Inoue, K [1 ]
Onodera, K [1 ]
Hirano, M [1 ]
Tokumitsu, T [1 ]
Toyoda, I [1 ]
机构：
[1] NTT, Wireless Syst Labs, Yokosuka, Kanagawa 2390847, Japan
来源：
1998 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 1998年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm(2). A U-band single-chip downconverter is also demonstrated.
引用
收藏
页码：313 / 316
页数：4
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