A structured approach for routing of MCMs.

被引:0
|
作者
Chuek, CH
Chai, CT
Chua, TG
机构
关键词
information technology; multichip modules;
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
This paper presents a structured methodology for routing of multichip modules (MCMs) suitable for an EDA system that can guarantee 100% completion of routes irrespective of connection density. It uses a rather simple and straightforward modularized approach which, not only guarantees 100% completion of routes, but also optimizes and pre-determines the number of layers required. This approach is structured using a Pre-sorter Module (PSM) and a Central Routing Adapter (CRA). Each chip or sub-module in an MCM will go through the PSM that re-arranges the node connection sequence by means of a horizontal-vertical matrix prior to the connection to the CRA. The CRA provides direct point-to-point connections based on the netlist for all chips or sub-modules in the MCM. The set of connections between the nodes of two chips (or sub-modules) is defined as a connection relationship, The number of connection relationships is n(n-1)/2, where n is the number of chips or sub-modules. By this approach, maximum number of layers in the CRA to route all connections among the chips or sub-modules will be (n-2). The design and development of these PSM and CRA will be elaborated, and a 4-chip MCM example is used for illustration in this paper.
引用
收藏
页码:255 / 259
页数:5
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