First-principles investigation of structural, mechanical and electronic properties for Cu-Ti intermetallics

被引:103
|
作者
Zhu, Y. D. [1 ]
Yan, M. F. [1 ]
Zhang, Y. X. [1 ]
Zhang, C. S. [2 ]
机构
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Natl Key Lab Precis Hot Proc Met, Harbin 150001, Peoples R China
[2] Southwest JiaoTong Univ, Sch Mat Sci & Engn, Chengdu 610000, Peoples R China
基金
中国国家自然科学基金;
关键词
Cu-Ti intermetallics; Phase stability; Mechanical properties; Electronic structure; First-principles study; ELASTIC PROPERTIES; TRIBOLOGICAL PROPERTIES; HIGH-CONDUCTIVITY; PHASE-STABILITY; HIGH-STRENGTH; MICROSTRUCTURE; ZR; BEHAVIOR; COPPER; PRECIPITATION;
D O I
10.1016/j.commatsci.2016.06.015
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To design a high-performance Cu-Ti intermetallic coating, first-principles calculation is conducted to systematically investigate the phase stability, mechanical and electronic properties of the Cu-Ti binary intermetallics. The phase stability and mechanical properties are studied by calculating the formation enthalpy and independent elastic constants, respectively. The calculated formation enthalpy indicates that beta-Cu4Ti, CuTi and CuTi2 are stable phases at 0 K, while alpha-Cu4Ti, Cu3Ti, Cu3Ti2, and Cu4Ti3 are meta-stable phases. In addition, the mechanical properties of Cu-Ti intermetallics present a positive correlation with their formation enthalpy. The electronic structures of the Cu-Ti intermetallics are evaluated by analyzing the bonds character to reveal the bonding characteristics, which is crucial to the phase stability and mechanical properties. Among the Cu-Ti intermetallics studied, CuTi phase exhibits the highest stability, hardness and a higher brittleness among all Cu-Ti intermetallics, while other Cu-Ti intermetallics show good toughness. Based on the calculated results, a high strength Cu-Ti intermetallic coating consisting of hard CuTi particles on a ductile Cu4Ti3 matrix is proposed. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:70 / 78
页数:9
相关论文
共 50 条
  • [1] First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics
    Chatterjee, Abhijit
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 132 - 136
  • [2] Structural, electronic, mechanical, and thermodynamic properties of Cu-Ti intermetallic compounds: First-principles calculations
    Xu, Yang
    Tian, Meiling
    Hu, Changyi
    Han, Zhaohui
    Zhou, Shenggang
    Cao, Yong
    SOLID STATE COMMUNICATIONS, 2022, 352
  • [3] First-Principles Investigation on Structural, Electronic, Mechanical, and Thermodynamic Properties of Intermetallics in Zr-Be Binary System
    Liu, Yao
    Zhai, Fangyi
    Mi, Guofa
    Liu, Chen
    Wang, Youchao
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 51 (05): : 1643 - 1649
  • [4] First-Principles Investigation on Structural, Electronic, Mechanical, and Thermodynamic Properties of Intermetallics in Zr-Be Binary System
    Liu Yao
    Zhai Fangyi
    Mi Guofa
    Liu Chen
    Wang Youchao
    RARE METAL MATERIALS AND ENGINEERING, 2022, 51 (05) : 1643 - 1649
  • [5] Structural properties, phase stability, elastic properties and electronic structures of Cu-Ti intermetallics
    Chen, Shuai
    Duan, Yong-Hua
    Huang, Bo
    Hu, Wen-Cheng
    PHILOSOPHICAL MAGAZINE, 2015, 95 (32) : 3535 - 3553
  • [6] First-principles investigation of structural, mechanical, electronic, and bonding properties of NaZnSb
    Jian-Bing Gu
    Chen-Ju Wang
    Lin Zhang
    Yan Cheng
    Xiang-Dong Yang
    Frontiers of Physics, 2015, 10 : 1 - 13
  • [7] First-principles investigation of structural, mechanical,electronic, and bonding properties of NaZnSb
    JianBing Gu
    ChenJu Wang
    Lin Zhang
    Yan Cheng
    XiangDong Yang
    Frontiers of Physics, 2015, 10 (04) : 83 - 95
  • [8] First-principles investigation of structural, mechanical, electronic, and bonding properties of NaZnSb
    Gu, Jian-Bing
    Wang, Chen-Ju
    Zhang, Lin
    Cheng, Yan
    Yang, Xiang-Dong
    FRONTIERS OF PHYSICS, 2015, 10 (04) : 1 - 13
  • [9] Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations
    Zhou, Wei
    Liu, Lijuan
    Li, Baoling
    Song, Qinggong
    Wu, Ping
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (02) : 356 - 364
  • [10] Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations
    Wei Zhou
    Lijuan Liu
    Baoling Li
    Qinggong Song
    Ping Wu
    Journal of Electronic Materials, 2009, 38 : 356 - 364