Studies on Curing Kinetics and Thermal Behavior of Phosphorylated Epoxy Resin in the Presence of Aromatic Amide-Amines

被引:12
|
作者
Durga, Geeta [1 ]
Kukreja, Parveen [1 ]
Narula, A. K. [1 ]
机构
[1] Guru Gobind Singh Indraprastha Univ, Sch Basic & Appl Sci, New Delhi 110006, India
关键词
phosphorylated epoxy; curing; thermal stability; flame retardancy; amide-amines; FLAME-RETARDANT; STABILITY; DIAMINES;
D O I
10.1002/app.30073
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
This article describes the synthesis of some novel aromatic amide-amine curing agents by reacting 1 mole of p-amino benzoic acid with 1 mole of each of 1,4-phenylene diamine (P), 1,5-diamino naphthalene (N), 4,4'-(9-fluorenyllidene)-dianiline (F), 3,4'-oxydianiline (O), and 4,4'-diaminodiphenyl sulphide (DS) and were designated as PA, NA, FA, OA, and SA, respectively. The aromatic amide-amines so synthesized were characterized with the help of spectroscopic techniques, viz., Fourier Transform Infrared, proton nuclear magnetic resonance, and carbon nuclear magnetic resonance. The curing kinetics of the epoxy resins obtained by reacting amines with diglycidyl ether of bisphenol-A blended with tris(glycidyloxy)phosphine oxide in a ratio of 3 : 2, respectively, were investigated by DSC technique using multiple heating rate method (5, 10, 15, 20 degrees C/min). Activation energies were determined by fitting the experimental data into Kissinger and Flynn-Wall-Ozawa Kinetic models. The activation energies obtained through Flynn-Wall-Ozawa method were slightly higher than Kissinger method but were comparable. However, both the energies were found to be dependent on the structure of amines. The thermal stability and weight loss behavior of isothermally cured thermosets were also investigated using thermogravimetric analysis in nitrogen atmosphere. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 118: 3612-3618, 2010
引用
收藏
页码:3612 / 3618
页数:7
相关论文
共 50 条
  • [1] Studies on the curing kinetics of epoxy resins using silicon containing amide-amines
    P. Khurana
    S. Aggarwal
    A. K. Narula
    V. Choudhary
    Journal of Thermal Analysis and Calorimetry, 2003, 71
  • [2] Studies on the curing kinetics of epoxy resins using silicon containing amide-amines
    Khurana, P
    Aggarwal, S
    Narula, AK
    Choudhary, V
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2003, 71 (02) : 613 - 622
  • [3] Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines
    Narula, A.K. (akn57@usa.net), 1600, John Wiley and Sons Inc. (87):
  • [4] Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines
    Khurana, P
    Aggarwal, S
    Narula, AK
    Choudhary, V
    JOURNAL OF APPLIED POLYMER SCIENCE, 2003, 87 (08) : 1345 - 1353
  • [5] Curing and thermal behaviour of epoxy resin in the presence of aromatic imide-amines
    Sharma, P
    Kukreja, P
    Choudhary, V
    Narula, AK
    INDIAN JOURNAL OF ENGINEERING AND MATERIALS SCIENCES, 2005, 12 (03) : 259 - 264
  • [6] Curing studies of epoxy resin with nadic endcapped phosphorylated amines
    Saraf, MN
    Alam, S
    Gupta, RK
    Surekha, K
    Mathur, GN
    JOURNAL OF THERMAL ANALYSIS, 1997, 49 (01): : 367 - 373
  • [7] Curing studies of epoxy resin with nadic endcapped phosphorylated amines
    M. N. Saraf
    Sarfaraz Alam
    R. K. Gupta
    K. Surekha
    G. N. Mathur
    Journal of thermal analysis, 1997, 49 : 367 - 373
  • [8] Curing Reaction Kinetics of Epoxy Resin Using Dicyandiamide Modified by Aromatic Amines
    CHEN Lianxi1
    2. School of Materials Science and Engineering
    Wuhan University Journal of Natural Sciences, 2007, (06) : 1105 - 1108
  • [9] Curing studies on epoxy resin with phosphorylated amine
    Alam, S
    Jayakumari, VG
    Kandpal, LD
    Mathur, GN
    INDIAN JOURNAL OF ENGINEERING AND MATERIALS SCIENCES, 1999, 6 (02) : 93 - 99
  • [10] Curing and thermal behaviour of epoxy resin in the presence of a mixture of imide-amines
    P. Sharma
    V. Choudhary
    A. K. Narula
    Journal of Thermal Analysis and Calorimetry, 2008, 94 : 805 - 815