Corrosion behavior of Sn-based lead-free solder alloys: a review

被引：70
|
作者：
Li, Shuai [1 ]
Wang, Xingxing [1 ]
Liu, Zhongying [1 ]
Jiu, Yongtao [2 ]
Zhang, Shuye [3 ]
Geng, Jinfeng [4 ]
Chen, Xiaoming [5 ]
Wu, Shengjin [1 ]
He, Peng [3 ]
Long, Weimin [2 ]
机构：
[1] North China Univ Water Resources & Elect Power, Sch Mech Engn, Zhengzhou 450045, Peoples R China
[2] Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Peoples R China
[3] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[4] State Grid Henan Elect Power Co, Elect Power Res Inst, Zhengzhou 450052, Peoples R China
[5] Minist Water Resources, Standard & Qual Control Res Inst, Key Lab Surface Engn Equipment Hydraul Engn Zheji, Hangzhou 310012, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2020年 / 31卷 / 12期
关键词：
AG3SN INTERMETALLIC COMPOUNDS; ELECTROCHEMICAL CORROSION; HIGH-TEMPERATURE; SN-3.0AG-0.5CU SOLDER; COOLING RATE; POLARIZATION CHARACTERISTICS; INTERFACIAL MICROSTRUCTURE; MECHANICAL-PROPERTIES; ALUMINUM ADDITION; ELECTROLYTE LAYER;
D O I：
10.1007/s10854-020-03540-2
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn-Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic products in long-term service. In this article, we review the recent progress on the corrosion behavior of Sn-based lead-free solder alloys by summarizing the results in representative ones of Sn-Bi, Sn-Cu, Sn-Zn, Sn-Ag, Sn-Ag-Cu and other multi-elements lead-free solder alloys. Specifically, the relationship between microstructure morphology and corrosion behavior, the corrosion mechanism of Sn-based lead-free solder alloys after incorporation of alloy elements or particles are summarized. It is hoped that this overview will provide some useful information in clarifying the corrosion mechanism and development of lead-free solder alloys. Furthermore, remaining difficulties and future trends in this research field are proposed.
引用
收藏
页码：9076 / 9090
页数：15
相关论文
共 50 条
  • [1] Corrosion behavior of Sn-based lead-free solder alloys: a review
    Shuai Li
    Xingxing Wang
    Zhongying Liu
    Yongtao Jiu
    Shuye Zhang
    Jinfeng Geng
    Xiaoming Chen
    Shengjin Wu
    Peng He
    Weimin Long
    [J]. Journal of Materials Science: Materials in Electronics, 2020, 31 : 9076 - 9090
  • [2] Electrochemical migration behavior of Sn-based lead-free solder
    Xiao Qi
    Haoran Ma
    Chen Wang
    Shengyan Shang
    Xiaogan Li
    Yunpeng Wang
    Haitao Ma
    [J]. Journal of Materials Science: Materials in Electronics, 2019, 30 : 14695 - 14702
  • [3] Electrochemical migration behavior of Sn-based lead-free solder
    Qi, Xiao
    Ma, Haoran
    Wang, Chen
    Shang, Shengyan
    Li, Xiaogan
    Wang, Yunpeng
    Ma, Haitao
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (15) : 14695 - 14702
  • [4] A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder
    Li, Yilin
    Yu, Shuyuan
    Li, Liangwei
    Song, Shijie
    Qin, Weiou
    Qi, Da
    Yang, Wenchao
    Zhan, Yongzhong
    [J]. METALS, 2023, 13 (07)
  • [5] Estimation of the Viscosities of Liquid Sn-Based Binary Lead-Free Solder Alloys
    Wu, Min
    Li, Jinquan
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (01) : 155 - 161
  • [6] Estimation of the viscosities of melt for Sn-based ternary lead-free solder alloys
    Wu, Min
    Li, Jinquan
    [J]. PHILOSOPHICAL MAGAZINE, 2019, 99 (20) : 2531 - 2544
  • [7] Research Progress of Sn-based Lead-Free Solder
    Pu Cunji
    Li Caiju
    Peng Jubo
    Zhang Xin
    Guo Shaoxiong
    Yi Jianhong
    [J]. RARE METAL MATERIALS AND ENGINEERING, 2023, 52 (09) : 3302 - 3315
  • [8] Estimation of the Viscosities of Liquid Sn-Based Binary Lead-Free Solder Alloys
    Min Wu
    Jinquan Li
    [J]. Journal of Electronic Materials, 2018, 47 : 155 - 161
  • [9] Research Progress of Sn-based Lead-Free Solder
    Pu, Cunji
    Li, Caiju
    Peng, Jubo
    Zhang, Xin
    Guo, Shaoxiong
    Yi, Jianhong
    [J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2023, 52 (09): : 3302 - 3315
  • [10] Effects of Joule Heating on the Impact Behavior of Lead-free Sn-based Solder Joints
    Liu, Sihan
    Liu, Fang
    Li, Zhe
    Xu, Guangchen
    Guo, Fu
    [J]. 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 652 - 656
12345