Machine vision algorithms for semiconductor wafer inspection: a project with Inspex

被引：6
|
作者：
Chen, CH [1 ]
Cheng, TH [1 ]
Wu, WT [1 ]
Driscoll, SA [1 ]
机构：
[1] Univ Massachusetts, Dept Elect & Comp Engn, N Dartmouth, MA 02747 USA
来源：
MACHINE VISION SYSTEMS FOR INSPECTION AND METROLOGY VII | 1998年 / 3521卷
关键词：
machine vision; light intensity alignment; wavelet-based approach; feature extraction; segmentation; defect extraction; algorithms for wafer inspection;
D O I：
10.1117/12.326963
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
With increased demand for reliable and automated semiconductor wafer inspection, machine vision techniques are much needed for defect extraction and identification and pre- & post-processing operations. The wavelet-based approach is emphasized in this paper for its capability to meet different needs in wafer inspection. The algorithms involved are illustrated by using a number of wafer inspection images.
引用
收藏
页码：221 / 228
页数：8
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