Low resistivity hafnium nitride thin films as diffusion barriers for Cu interconnects

被引：0
|
作者：
Araujo, Roy A. [1 ]
Zhang, X. [2 ]
Wang, H. [1 ]
机构：
[1] Texas A&M Univ, Dept Elect & Comp Engn, College Stn, TX 77843 USA
[2] Texas A&M Univ, Dept Mech Engn, College Stn, TX 77843 USA
来源：
2007 INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, VOLS 1 AND 2 | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：270 / +
页数：2
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