A novel low impedance line for MMIC using air-gap stacked structure

被引：0
|
作者：
Ryu, GH [1 ]
Kim, DH [1 ]
Lee, JH [1 ]
Seo, KS [1 ]
机构：
[1] Seoul Natl Univ, Sch Elect Engn, Kwanak Ku, Seoul 151742, South Korea
来源：
2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel low impedance line for MMIC is proposed which uses air-gap stacked microstrip structure and does not require any dielectric process. The proposed transmission line has the width of about 1/3 times that of the conventional microstrip line. It shows lower transmission loss than thin film low impedance transmission line. The proposed transmission line was used to the matching stub of the balanced amplifier MMIC based on the 0.25 mum gate GaAs P-HEMT technology, reducing the chip size by 69 % compared with the conventional microstrip-based design.
引用
收藏
页码：613 / 616
页数：4
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