Construction and Application of Electro-Thermal Co-simulation Platform

被引：2
|
作者：
Pan, Zhengwei [1 ,2 ]
Luo, Jian [1 ,2 ]
Dong, Changcheng [1 ,2 ]
Liu, Xuguang [1 ,2 ]
Wang, Rui [1 ,2 ]
Yao, Erxian [1 ,2 ]
机构：
[1] Nari Grp Corp, Nanjing, Peoples R China
[2] NARI GEIRI Power Semicond Co Ltd, Nanjing, Peoples R China
来源：
2020 IEEE 2ND INTERNATIONAL CONFERENCE ON CIRCUITS AND SYSTEMS (ICCS 2020) | 2020年
关键词：
electro-thermal; reduced ordered model; dynamic characteristic package model; MODEL;
D O I：
10.1109/ICCS51219.2020.9336616
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces the construction and application of the electro-thermal co-simulation platform. Based on the finite element method, we first established a device-level simulation model of IGBT and diode with dynamic characteristics; at the same time, we extracted the corresponding network model through CFD simulation calculation of the transient operating conditions of the IGBT device; then, using 1200V 600A IGBT as an example to build a complete electro-thermal co-simulation platform; finally, the simulation data of the electro-thermal co-simulation platform and the test data of the developed 1200V 600A device are tested and verified under the same working conditions.
引用
收藏
页码：15 / 19
页数：5
相关论文
共 50 条
  • [1] A Fast Electro-Thermal Co-Simulation Modeling Approach for SiC Power MOSFETs
    Ceccarelli, Lorenzo
    Bahman, Amir Sajjad
    Iannuzzo, Francesco
    Blaabjerg, Frede
    2017 THIRTY SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2017, : 966 - 973
  • [2] An Iterative Novel Co-Simulation Method for Electro-Thermal Multiphysics Analysis of RF Power Amplifier
    Lou, Xu-Feng
    Sun, Kang-Min
    Wang, Jian
    Xia, Yin-Shui
    Wu, Wei-Jun
    Yin, Wen-Yan
    IEEE ACCESS, 2025, 13 : 30636 - 30645
  • [3] Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions.
    Langbauer, Thomas
    Mentin, Christian
    Rindler, Michael
    Vollmaier, Franz
    Connaughton, Alexander
    Krischan, Klaus
    2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019), 2019,
  • [4] A Novel Multi-physics and Circuit Co-simulation Algorithm for the Electro-thermal Analysis of Semiconductors and Circuits
    Chen, J. Q.
    Chen, X.
    PIERS 2012 MOSCOW: PROGRESS IN ELECTROMAGNETICS RESEARCH SYMPOSIUM, 2012, : 715 - 719
  • [5] Research on Electro-Thermal Coupling Simulation Platform of Switching Mode Power Supply
    Sun Bo
    Ye Xuerong
    Wang Cong
    Qi Ming
    Zhai Guofu
    PROCEEDINGS OF THE 2015 FIRST INTERNATIONAL CONFERENCE ON RELIABILITY SYSTEMS ENGINEERING 2015 ICRSE, 2015,
  • [6] COUPLED ELECTRO-THERMAL SIMULATION OF MOSFETs
    Ni, Chunjian
    Aksamija, Zlatan
    Murthy, Jayathi Y.
    Ravaioli, Umberto
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 161 - 173
  • [7] Electro-thermal simulation with the SISSI package
    Székely, V
    Páhi, A
    Poppe, A
    Rencz, M
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 1999, 21 (01) : 21 - 31
  • [8] Electro-Thermal Simulation with the SISSI Package
    V. Sze´kely
    A. Pa´hi
    A. Poppe
    M. Rencz
    Analog Integrated Circuits and Signal Processing, 1999, 21 : 21 - 31
  • [9] Coupled electro-thermal simulation of MOSFETs
    Ni, Chunjian
    Aksamija, Zlatan
    Murthy, Jayathi Y.
    Ravaioli, Umberto
    JOURNAL OF COMPUTATIONAL ELECTRONICS, 2012, 11 (01) : 93 - 105
  • [10] Electro-thermal simulation of MEMS elements
    Rencz, M
    Székely, V
    Poppe, A
    Courtois, B
    DTIP 2003: DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2003, 2003, : 15 - 20
12345