Measuring the fracture toughness of ultra-thin films with application to AlTa coatings

被引:25
|
作者
Xiang, Yong
McKinnell, James
Ang, Wie-Ming
Vlassak, Joost J.
机构
[1] Harvard Univ, Sch Appl & Engn Phys, Cambridge, MA 02138 USA
[2] Hewlett Packard Corp, Technol Dev Org, Corvallis, OR 97330 USA
基金
美国国家科学基金会;
关键词
thin films; bulge test; fracture toughness;
D O I
10.1007/s10704-007-9095-0
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An experimental technique is presented for measuring the fracture toughness of brittle thin films. In this technique, long rectangular membranes are fabricated from the film of interest using standard silicon micromachining techniques. A focused ion beam is then used to introduce pre-cracks of different lengths along the centerline of the membranes and the membranes are pressurized until rupture. The fracture stress of the membrane is measured as a function of pre-crack length and the fracture toughness of the film is determined from a simple fracture mechanics analysis. The technique is applicable to a wide range of materials and is especially suited for ultra-thin films. We have demonstrated the experimental procedure for a 150 nm AlTa intermetallic film and obtained a room-temperature fracture toughness of K-1c, = 4.44 +/- 0.21 MPam(1/2).
引用
收藏
页码:173 / 179
页数:7
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