Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

被引：35
|
作者：
Qasaimeh, Awni [1 ]
Hamasha, Sa'd [2 ]
Jaradat, Younis [2 ]
Borgesen, Peter [2 ]
机构：
[1] Tennessee Technol Univ, Dept Mfg & Engn Technol, Cookeville, TN 38505 USA
[2] SUNY Binghamton, Dept Syst Sci & Ind Engn, Binghamton, NY 13902 USA
来源：
JOURNAL OF ELECTRONIC PACKAGING | 2015年 / 137卷 / 02期
基金：
美国国家科学基金会;
关键词：
LOW-CYCLE FATIGUE; CRACK-GROWTH-BEHAVIOR; MECHANICAL FATIGUE; LIFE PREDICTION; ENERGY;
D O I：
10.1115/1.4029441
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The extrapolation and generalization of accelerated test results for lead free solder joints require the identification of a damage function that can be counted on to apply beyond the region of the test. Individual ball grid array (BGA) scale Sn3Ag0.5Cu (SAC305) solder joints were subjected to isothermal shear fatigue testing at room temperature and 65 degrees C. The resulting mechanical response degradation and crack behavior, including strain hardening, crack initiation, and propagation, were correlated with the inelastic work and effective stiffness derived from load-displacement hysteresis loops. Crack initiation was found to scale with the accumulated work, independently of cycling amplitude and strain rate. The subsequent damage rate varied slightly with amplitude.
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页数：8
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