Thermal Semiconductor Systems-An Innovative Conduction Heat Transfer Applications

Thermal systems make the most of the conduction heat transfer across the matter. In contrast with the thermal rectification phenomenon, the thermal semi conduction mechanism provides innovative solutions to support the unidirectional heat conduction through the matter. Basic thermal semi conductor (TSC) models are introduced in order to verify their operation of such innovative systems. Based on theoretical computational simulations, thermal semi conduction ratios (i.e., the ratio between the heat transfer conduction in one direction and in its respective reverse direction) in the range of 2769 could be achieved. The significance of this paper lies in the original introduction of the of TSC systems, demonstrating its preliminary feasibility. The encouraging results of this work should give the basis for developing promising TSC systems that should provide solutions for many thermal design problems.