Electroplating of HR-2 Stainless Steel by Aluminum in Ambient Temperature Chloroaluminate Melts

被引:0
|
作者
Zhang Guikai [1 ]
Li Ju [1 ]
Chen Chang'an [1 ]
Li Yan [2 ]
Ling Gouping [2 ]
机构
[1] Natl Key Lab Surface Phys & Chem, Mianyang 621907, Peoples R China
[2] Zhejiang Univ, Hangzhou 310027, Peoples R China
关键词
aluminum electrodeposition; HR-2 stainless steel; ambient temperature chloroaluminate melts; Tritium Penetration Barrier (TPB); ELECTRODEPOSITION; CHLORIDE; DISSOLUTION; DEPOSITION; NUCLEATION; MORPHOLOGY;
D O I
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中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To fabricate Tritium Penetration Barrier (TBP) of aluminide coating on stainless steel, aluminum electrodeposition experiments on the HR-2 stainless steel were carried out by ambient temperature chloroaluminate melts AlCi(3)(aluminum chloride)/EMIC (1-ethyl-3-methylimidazolium chloride) under the protection of argon gas. The influences of pre-treatment of the substrate and the current density on the surface morphology, purity and adhesion of the aluminum coating were examined. The results show that the aluminum electrodeposition on HR-2 stainless steel by ambient temperature melts system AlCl3/MEIC is feasible. The aluminum coating on the HR-2 stainless steel substrate with conventional pretreatment is of high quality but the adherence to the substrate is not good. However, electrochemical etching of the substrate by anodic polarization prior to electroplating leads to well-adherent Al coating of HR-2 stainless steel. The deposited aluminum coating is white, smooth, uniform and dense, having the characteristics of irregular sphere particle-like growth with certain edge angle. The particle size of the aluminum coating increases with increasing current density. The preferable range of current density is 10-20 mA/cm(2), and the electroplating time is 40 min at least.
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页码:1219 / 1223
页数:5
相关论文
共 18 条
  • [1] An overview on tritium permeation barrier development for WCLL blanket concept
    Aiello, A
    Ciampichetti, A
    Benamati, G
    [J]. JOURNAL OF NUCLEAR MATERIALS, 2004, 329 : 1398 - 1402
  • [2] Development of tritium permeation barriers on Al base in Europe
    Benamati, G
    Chabrol, C
    Perujo, A
    Rigal, E
    Glasbrenner, H
    [J]. JOURNAL OF NUCLEAR MATERIALS, 1999, 271 : 391 - 395
  • [3] NUCLEATION AND MORPHOLOGY STUDIES OF ALUMINUM DEPOSITED FROM AN AMBIENT-TEMPERATURE CHLOROALUMINATE MOLTEN-SALT
    CARLIN, RT
    CRAWFORD, W
    BERSCH, M
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (10) : 2720 - 2727
  • [4] Improved corrosion resistance of magnesium alloy with a surface aluminum coating electrodeposited in ionic liquid
    Chang, Jeng-Kuei
    Chen, Su-Yau
    Tsaia, Wen-Ta
    Deng, Ming-Jay
    Sun, I. -Wen
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (03) : C112 - C116
  • [5] FENG QQ, 2000, THESIS ZHEJIANG U HA
  • [6] HAN WS, 2005, MAT PROTECTION, V38, P1
  • [7] Electrodeposition of aluminium from ionic liquids:: Part I -: electrodeposition and surface morphology of aluminium from aluminium chloride (AlCl3)-l-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquids
    Jiang, T.
    Brym, M. J. Chollier
    Dube, G.
    Lasia, A.
    Brisard, G. M.
    [J]. SURFACE & COATINGS TECHNOLOGY, 2006, 201 (1-2): : 1 - 9
  • [8] KONYS J, 2004, P ITER TBM PROJ M FE
  • [9] ELECTRODEPOSITION OF ALUMINUM IN ALUMINUM CHLORIDE/1-METHYL-3-ETHYLIMIDAZOLIUM CHLORIDE
    LAI, PK
    SKYLLAS-KAZACOS, M
    [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1988, 248 (02) : 431 - 440
  • [10] ALUMINUM DEPOSITION AND DISSOLUTION IN ALUMINUM CHLORIDE-NORMAL-BUTYLPYRIDINIUM CHLORIDE MELTS
    LAI, PK
    SKYLLAS-KAZACOS, M
    [J]. ELECTROCHIMICA ACTA, 1987, 32 (10) : 1443 - 1449