Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moire interferometry

被引：14
|
作者：
Joo, J [1 ]
Cho, S
Han, B
机构：
[1] Chungbuk Natl Univ, Dept Mech Engn, Cheongju 361763, Chungbuk, South Korea
[2] Univ Maryland, Dept Engn Mech, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA
来源：
MICROELECTRONICS RELIABILITY | 2005年 / 45卷 / 3-4期
关键词：
D O I：
10.1016/j.microrel.2004.10.006
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Flexural and thermo-mechanical behavior of a wire-bond plastic ball grid array (WB-PBGA) package assembly is characterized using moire interferometry. Fringe patterns are recorded and analyzed at several bending loads and temperatures. Detailed global and local deformations of the assembly are investigated. The deformations caused by the thermally induced bending are compared with those caused by the mechanical bending. The results reveal that global bending modes are similar but the deformations at the critical locations are significantly different; the sign (direction) of the shear strain caused by the mechanical bending is the opposite of that caused by the thermal loading. The implication of the opposite bending on board level reliability is discussed. (C) 2004 Published by Elsevier Ltd.
引用
收藏
页码：637 / 646
页数：10
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