Bonding method of semiconductor devices on piezoelectric substrate using laser enhanced flip-chip technology

被引：0
|
作者：
Koh, K [1 ]
Kaneshiro, C [1 ]
Hohkawa, K [1 ]
机构：
[1] Kanagawa Inst Technol, Fac Engn, Atsugi, Kanagawa 2430292, Japan
来源：
2004 IEEE ULTRASONICS SYMPOSIUM, VOLS 1-3 | 2004年
关键词：
D O I：
暂无
中图分类号：
O42 [声学];
学科分类号：
070206 ; 082403 ;
摘要：
In this paper, we report new flip-chip bonding technology with laser assisted, in which, semiconductor devices cab be bonded on the piezoelectric substrate with small size paste bump. We formed paste bump with nano-particles on piezoelectric substrate using screen printing and used laser to locally curer paste bump. We investigated bonded processes conditions such as laser power, heating time and electrical property of bump junction. The experimental results indicated that possibility of the new bonding technology.
引用
收藏
页码：1892 / 1895
页数：4
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