Heat transfer in a vertical stacking of plastic packages

被引：0
|
作者：
Scudeller, Y [1 ]
Val, C [1 ]
机构：
[1] ISITEM, URA CNRS 869, Lab Thermocnet Equipe Therm Interfaces & Microthe, Nantes, France
来源：
THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II | 1997年
关键词：
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
This paper presents a study of heat transfer in a vertical stacking of plastic packages. The work is based on experiments and simulations. An experimental module, integrating a great number of temperature sensors, has been set up. Temperature profiles, inside the module, have been measured and correlations with natural convection have been identified. An original compact model has been developed.
引用
收藏
页码：73 / 82
页数：10
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