Electrodeposition and characterization of nanocrystalline CoNiFe films

被引：21
|
作者：
Chen, Y. [1 ]
Wang, Q. P. [1 ]
Cai, C. [2 ]
Yuan, Y. N. [3 ]
Cao, F. H. [1 ]
Zhang, Z. [1 ]
Zhang, J. Q. [1 ,4 ]
机构：
[1] Zhejiang Univ, Dept Chem, Hangzhou 310027, Zhejiang, Peoples R China
[2] Ningxia Univ, Sch Chem & Chem Engn, Yinchuan 750021, Peoples R China
[3] Zhejiang Univ, Dept Mat & Chem, Hangzhou 310027, Zhejiang, Peoples R China
[4] State Key Lab Corros & Protect Met, Shenyang 110016, Peoples R China
来源：
THIN SOLID FILMS | 2012年 / 520卷 / 09期
基金：
中国国家自然科学基金;
关键词：
Nanocrystalline CoNiFe film; Electrodeposition; Cyclic voltammetry; Impedance spectroscopy; ELECTROCHEMICAL NUCLEATION; INGOT IRON; IMPEDANCE; KINETICS; BEHAVIOR; CORROSION; ALUMINUM; DENSITY; GROWTH;
D O I：
10.1016/j.tsf.2012.01.007
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Nanocrystalline Co45Ni10Fe24 films have been fabricated using cyclic voltammetry technique from the solutions containing sulfate, then characterized by scanning electron microscopy, X-ray diffraction and vibrating sample magnetometer. Meanwhile, Electrochemical Impedance Spectroscopy technique has been employed to probe into the nucleation/growth behavior of Co45Ni10Fe24 films. The results show that, the obtained Co45Ni10Fe24 film possesses low coercivity of 973.3 A/m and high saturation magnetic flux density of 1.59 x 10(5) A/m. Under the experimental conditions, the nucleation/growth process of Co45Ni10Fe24 films is mainly under activation control. With the increase of the applied cathodic potential bias, the charge transfer resistance for CoNiFe deposition decreases exponentially. (C) 2012 Elsevier B.V. All rights resented.
引用
收藏
页码：3553 / 3557
页数：5
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