The advantages of mildly alkaline immersion silver as a final finish for solderability

被引：11
|
作者：
Fang, Jing Li [1 ]
Chan, Daniel K. [1 ]
机构：
[1] Chartermate Elect Ltd, Hong Kong, Hong Kong, Peoples R China
来源：
CIRCUIT WORLD | 2007年 / 33卷 / 02期
关键词：
alkalinity; silver; soldering; acidity;
D O I：
10.1108/03056120710750940
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Purpose - This study seeks to examine the advantages of mildly alkaline immersion silver as a final finish for solderability in order to combat the shortcomings of acidity in some popular immersion silver solutions. Design/methodology/approach - The paper describes in detail the necessary steps in the mildly alkaline immersion silver process. Findings - The process can overcome the problems of conventional acidic immersion silvers, especially in thermal shock and stress testing. Also it does not affect soldering or aluminium wire bonding. Originality/value - This is arguably a pioneering study in that it posits the benefits of mildly alkaline immersion silver as a final finish for solderability.
引用
收藏
页码：43 / 51
页数：9
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