MOCVD Grown AlGaN/GaN Transistors on Si Substrate for High Power Device Applications

被引:1
|
作者
Selvaraj, S. Lawrence [1 ]
Egawa, Takashi [1 ]
机构
[1] Nagoya Inst Technol, Res Ctr Nanodevice & Syst, Nagoya, Aichi 4668555, Japan
来源
HETEROSIC & WASMPE 2011 | 2012年 / 711卷
关键词
AlGaN/GaN; HEMT; MOCVD; breakdown voltage; breakdown field; buffer leakage; substrate leakage; compressive strain; wafer bowing; figure of merit; DOPED GAN; BUFFER; HEMTS;
D O I
10.4028/www.scientific.net/MSF.711.195
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An extensive study on the use of Si as a substrate for the growth of AlGaN/GaN layers for High-Electron-Mobility Transistor (HEMT) were studied and reported in this article. We have used thick buffers to grow high resistive i-GaN by MOCVD which offers a high breakdown voltage. While the leakage through buffer and substrate can be controlled by thick buffer, the leakage through gate is controlled using a thin 2-nm in-situ grown i-GaN cap layer. We have evidenced a high figure of merit (Bv(2)/R-ON) of 2.6 x 10(8) V-2 Omega(-1)cm(-2) for AlGaN/GaN HEMTs grown on 4-inch Si substrate. The challenges before the MOCVD growth of GaN on Si is also discussed in detail.
引用
收藏
页码:195 / 202
页数:8
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