Manufacturing of low cost smart labels

Smart Labels are paper thin RFID (Radio Frequency IDentification) devices with a semiconductor device (die) electrical connected to an antenna structure. Typical applications for these components will be the replacement of bar code labels in applications like luggage identification at airports or the identification of express mail service parcels. Given the ultra thin and flexible form factor, SmartLabels present new packaging and interconnect challenges. This paper describes a manufacturing process using NCS (N anoPierce Connection System) technology to connect the semiconductor device to the antenna. A comparison between existing Flip-Chip or COB technologies and the NCS technology is shown especially under consideration of the technical requirements of smart labels. It is also shown that a fast process and the immediate testability of the packaged RFID device support the design of high-speed production equipment with a significant reduction in the number of functions and process steps. The resulting overall yield is expected to improve while the initial capital investment decreases.