The dry sliding wear behavior of SiCp/Cu composites

被引:5
|
作者
Zhan, YZ [1 ]
Zhang, GD [1 ]
机构
[1] Shanghai Jiao Tong Univ, State Key Lab Met Matrix Composites, Shanghai 200030, Peoples R China
来源
COMPOSITE MATERIALS III | 2003年 / 249卷
关键词
SiCp/Cu composite; wear resistance; adhesive wear; MML layer;
D O I
10.4028/www.scientific.net/KEM.249.227
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The wear behavior of SiC particle reinforced copper matrix Composites was investigated. The SiC reinforcement improves the wear resistance and impedes severe adhesive wear at high loads, while increasing the friction coefficient and the wear loss of the counterpart. The presence of an iron-rich MML on the worn surfaces of the composites influences the wear behavior effectively. At low loads, the wear mechanism for SiCpCu composites is the removal of SiC particles from the matrix by micro-plowing effect or the pulling off of particles. At high loads, interfacial crack propagation induced delamination of the subsurface materials or scaling off of the MML are the main wear mechanisms.
引用
收藏
页码:227 / 232
页数:6
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