Corrosion of copper in acid-sulfate plating baths with additives

Acid copper plating baths exposed to air present a corrosive environment for copper. With feature sizes in some plating applications falling well below the micrometer scale, dissolution of metal at open circuit potential may become a consideration in process design. This paper presents a reaction-zone model of the corrosion process that can be used to estimate corrosion rates based on process parameters and open-circuit potential measurements. Corrosion of copper in acid-sulfate plating baths with additives chloride, benzotriazole and his (3-sulfopropyl) disulfide is examined experimentally with the aid of the model.